Over the past decade, we have invested millions of euros in production technology and data systems.
Surface mount assembly
We are using SPI (Solder Paste Inspection) and AOI (Automatic Optical Inspection) equipment in quality assurance for verifying the paste application and the correct positioning and soldering of components. We use X-ray equipment for the solder joint inspection of µBGA and BGA components.
For protecting electronics with lacquer, we use selective lacquering lines according to the customer’s needs.
We use a low-pressure molding process on electronics.
Reflow and wave soldering
We have vapor phase reflow equipment in addition to nitrogen reflow ovens. For wave soldering, we use a wave soldering line or selective soldering machines that use nitrogen.
We use various routers and a laser for removing modules from panels.