We are using SPI (Solder Paste Inspection) and AOI (Automatic Optical Inspection) equipment in quality assurance for verifying the paste application and the correct positioning and soldering of components. We use X-ray equipment for the solder joint inspection of µBGA and BGA components.
Protecting electronics
Lacquering: For protecting electronics with lacquer, we use selective lacquering lines according to the customer’s needs.
Hotmelt molding: We use a low-pressure molding process on electronics.
Reflow and wave soldering
We have vapor phase reflow equipment in addition to nitrogen reflow ovens. For wave soldering, we use a wave soldering line or selective soldering machines that use nitrogen.
Panel disassembly
We use various routers and a laser for removing modules from panels.
Efficient and capable production technology
We are constantly and ambitiously developing our processes in order to maintain our competitiveness and position among the top suppliers in the industry.
Focusing on a single plant allows for a cost-effective organization.